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  this document was generated on 05/14/2010 please check www.molex.com for latest part information part number: 0736561000 status: active overview: hdm description: 2.00mm (.079") pitch hdm? board-to-board backplane power module, vertical, smc, power receptacle, 3 circuits, gold (au) 0.76m (30") documents: 3d model product specification ps-73670-9999 (pdf) drawing (pdf) rohs certificate of compliance (pdf) general product family backplane connectors series 73656 application backplane comments midplane power module component type power header overview hdm product name hdm? style n/a physical circuits (loaded) 3 circuits (maximum) 3 color - resin black durability (mating cycles max) 250 first mate / last break no guide to mating part no keying to mating part none material - metal beryllium copper material - plating mating gold material - plating termination gold material - resin high temperature thermoplastic number of columns 1 number of pairs open pin field number of rows 3 orientation vertical pc tail length (in) 0.138 in pc tail length (mm) 3.50 mm pcb locator no pcb retention yes pcb thickness recommended (in) 0.098 in pcb thickness recommended (mm) 2.50 mm packaging type tube pitch - mating interface (in) 0.000 in pitch - mating interface (mm) 0.00 mm plating min: mating (in) 30 plating min: mating (m) 0.75 plating min: termination (in) 2 plating min: termination (m) 0.05 polarized to pcb yes stackable no surface mount compatible (smc) no temperature range - operating -55c to +105c termination interface: style through hole - compliant pin electrical series image - reference only eu rohs china rohs elv and rohs compliant reach svhc contains svhc: no halogen-free status halogen-free need more information on product environmental compliance? email productcompliance@molex.com for a multiple part number rohs certificate of compliance, click here please visit the contact us section for any non-product compliance questions. search parts in this series 73656 series mates with 73651 hdm? board-to-board daughterboard power module application tooling | faq tooling specifications and manuals are found by selecting the products below. crimp height specifications are then contained in the application tooling specification document. global description product # hdm? backplane power module loading heads 0622005711
current - maximum per contact 15a data rate 1.0 gbps shielded no voltage - maximum 500v ac material info reference - drawing numbers application specification as-73656-1998 packaging specification pk-70873-0819 product specification ps-73670-9999 sales drawing sda-73656-*00* hdm and high density metric are trademarks of amphenol corporation this document was generated on 05/14/2010 please check www.molex.com for latest part information






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